A Temperature Control Stage for Deposition of Thin Metal Films

dc.contributor.authorFall, Owen
dc.contributor.authorYelle, Luke
dc.contributor.authorHoffman, Brandon
dc.date.accessioned2023-04-20T20:26:07Z
dc.date.available2023-04-20T20:26:07Z
dc.date.issued2023-04-15
dc.description.abstractBecause the properties of the films are significantly affected by a deposition temperature change of only several degrees Celsius, it is vital that the substrate temperature be uniform across the entire substrate and constant throughout the deposition process, even while it is being radiatively heated by the evaporant metal. A temperature control substrate stage is being developed at Houghton University for thin metal films produced on 10 cm Si substrates via physical vapor deposition, with a base pressure of 10-6 Torr. To test possible substrate-stage adhesion materials, a test chamber was set up containing a substrate fixed to a 10 cm diameter aluminum heat sink. Resistive wire was epoxied to the substrate surface to simulate the ~6.5 W of radiative heating that would occur during deposition. Using double-sided copper tape, the minimum temperature change was 18°C in 10 minutes. Adding clamps decreased this to 13°C in 10 minutes. Using Ag paste as an adhesive resulted in a temperature change of only 3°C in 10 minutes.
dc.description.statementofresponsibilityXLI Annual Rochester Symposium for Physics Students, University of Rochester (Rochester, NY), April 15, 2023.
dc.identifier.urihttps://dspace.houghton.edu/handle/hc/3948
dc.publisherHoughton University
dc.rightsAuthors retain the copyright for all content posted in this repository. This material may not be published, reproduced, broadcast, rewritten, or redistributed beyond the Houghton University community without permission except in accordance with fair use doctrine.
dc.subjectStudent Projects
dc.titleA Temperature Control Stage for Deposition of Thin Metal Films
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