A Temperature Control Stage for the Deposition of Thin Metal Films

dc.contributor.authorFall, Owen
dc.contributor.authorYelle, Luke
dc.contributor.authorHoffman, Brandon
dc.date.accessioned2024-04-20T16:18:36Z
dc.date.available2024-04-20T16:18:36Z
dc.date.issued2024-04-20
dc.description.abstractA thermal substrate stage was developed for physical vapor deposition of thin metal films. The stage can maintain a uniform, constant temperature across a 4 cm diameter substrate throughout the deposition process, even while it is being radiatively heated at ~5 W for 10 min by the evaporate metal. The substrate is adhered to an 11 cm diameter, 6.4 cm long aluminum heat sink. Previous experiments concluded that Ag paste produced the best thermal contact between the substrate and heat sink. To balance the most surface area possible for thermal contact and removability of the paste, grooves were made in the heat sink. The control stage features ceramic standoffs, holding the aluminum heat sink to the inside of the deposition chamber, and a heater wire pasted to the heat sink to initialize and stabilize the desired temperature.
dc.description.statementofresponsibilityXLII Annual Rochester Symposium for Physics Students, University of Rochester, April 20, 2024
dc.identifier.urihttps://dspace.houghton.edu/handle/hc/4185
dc.publisherHoughton University
dc.rightsAuthors retain the copyright for all content posted in this repository. This material may not be published, reproduced, broadcast, rewritten, or redistributed beyond the Houghton University community without permission except in accordance with fair use doctrine.
dc.subjectStudent Projects
dc.titleA Temperature Control Stage for the Deposition of Thin Metal Films
dc.title.alternativeDesigning and Constructing a Heater Stage for a Physical Vapor Deposition Chamber
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