Effects of Deposition Temperature on Stacking Fault Density, Texture Transformation in Thin Silver Films

dc.contributor.authorOlandt, Sarah
dc.contributor.authorZhuravlev, Daniil
dc.contributor.authorHoffman, Brandon
dc.contributor.authorRogers, Nate
dc.contributor.authorBaker, Shefford
dc.date.accessioned2019-03-30T18:50:15Z
dc.date.available2019-03-30T18:50:15Z
dc.date.issued2019-03-30
dc.description.abstractX-Ray Diffraction analysis was used to measure stacking fault density and texture transformation in silver films created with electron-beam evaporation techniques. Films were heated during the deposition process to obtain samples with different deposition temperatures. Samples were analyzed using X-Ray Diffraction for texture and fault density in as-deposited states and after intervals of annealing. Analysis of scans reveals fewer faults and less (111) to (100) texture transformation in films deposited at higher
dc.description.statementofresponsibilityXXXVIII Annual Rochester Symposium for Physics Students, University of Rochester, March 30, 2019.
dc.identifier.urihttps://dspace.houghton.edu/handle/hc/3636
dc.publisherHoughton College
dc.rightsAuthors retain the copyright for all content posted in this repository. This material may not be published, reproduced, broadcast, rewritten, or redistributed beyond the Houghton College community without permission except in accordance with fair use doctrine.
dc.subjectStudent Projects
dc.titleEffects of Deposition Temperature on Stacking Fault Density, Texture Transformation in Thin Silver Films
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